Fifty-four papers were presented on the then state-of-the-art in electron device technology, the majority of them from four U.S. companies -- Bell Telephone Laboratories, RCA Corporation, Hughes Aircraft Co. and Sylvania Electric Products.
[12] There were also a broad range of papers addressing some of the fastest-growing specialized areas in micro/nanoelectronics, including silicon photonics,[13] physically flexible circuits,[14] and brain-inspired computing.
Professor Gerhard Fettweis of TU Dresden, meanwhile, spoke about new ways to structure research into semiconductors to effectively pursue non-traditional uses such as bendable, flexible electronic systems.
The technical program featured many noteworthy papers on a range of topics, such as innovative memories for AI applications; quantum computing; wireless communications; power devices; and many more.
Robert Chau, Intel Senior Fellow, gave a Plenary talk in which he discussed how ongoing innovation will help the industry stay on the path of Moore’s Law.
The technical program was highlighted by talks from Intel Corp. on a 3D stacked nanosheet transistor architecture,[30] and from Taiwan Semiconductor Manufacturing Co., which gave details about its 5 nm CMOS FinFET technology.
[31] The 67th annual IEEE International Electron Devices Meeting was held December 11–15, 2021 at the Hilton San Francisco Union Square hotel, with on-demand content available afterward.
The Plenary talks were: The Smallest Engine Transforming Humanity: The Past, Present, and Future, by Kinam Kim, Vice Chairman & CEO, Head of Samsung Electronics Device Solutions Division, Samsung; Creating the Future: Augmented Reality, the Next Human-Machine Interface, by Michael Abrash, Chief Scientist, Facebook Reality Labs; and Quantum Computing Technology, by Heike Riel, Head of Science & Technology, IBM Research and IBM Fellow.