This is an accepted version of this page Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry.

[2] Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects).

[12] In the mid-1980s, Lam Research continued its global expansion, concentrating on Taiwan and also opening customer support centers throughout Europe, the United States and Japan.

[15] In October 2015, Lam Research announced plans to buy Milpitas, California–based wafer inspection equipment vendor KLA-Tencor for $10.6bn, in what was viewed as a semiconductor industry consolidation move.

[27] In December 2018, Martin Anstice resigned as CEO due to allegations of personal misconduct, and the Board of Directors of Lam Research named Tim Archer as president and chief executive officer.

In August 2021, Lam opened a manufacturing facility in Batu Kawan, Malaysia to meet the growing demand for wafer fabrication equipment and to work more closely with key customers and supply chain partners.

This center will be utilized for engineering, testing, and research and development of wafer manufacturing hardware and software, which are used to create memory components including DRAM, NAND, and logic technologies.This is Lam's second R&D lab and third Indian facility.

The new facility will lessen the Indian engineers' dependency on their US counterparts by enabling them to finish designs domestically and shift the bulk of Lam's international activities to India.

[34] Lam's thin film deposition systems lay down the sub-microscopic layers of conducting (metal) or insulating (dielectric) materials that make up an integrated circuit.

[41] Lam Research uses proprietary technology in its equipment for plasma etch,[42] the process of selectively removing materials from the surface of a wafer to create the semiconductor device's features and patterns.

Lam's dry strip systems use plasma technology to selectively remove the photoresist mask following a range of front-end wafer processing and advanced packaging applications.