According to the research firm Yole Développement, the fan-out packaging market is predicted to reach $2.4 billion by 2020, increasing from $174 million in 2014.

[14] According to the research firm Yole Développement, the flip chip technology market value is expected to reach $25 billion in 2020.

[16] This packaging technology is used in applications such as high memory bandwidth, network switches, router chips[16] and graphics cards for the gaming market.

[17] The two companies collaborated on Fiji, a 2.5D-based GPU processor designed for extreme gamers, which is small enough to fit a 6-inch PCB and connects 240,000 bumps.

[20] SiP technology is being driven by market application trends in wearables, mobile devices and Internet of Things (IoT).

[22] The company's main operations are in Kaohsiung, Taiwan, with other plants located in China, South Korea, Japan, Malaysia and Singapore.

It also has offices and service centers in China, South Korea, Japan, Singapore, Belgium and the United States.

[26] In December 2014, after checking the company's improvement on wastewater treatment, the EPB officials agreed to allow the K7 facility to resume operations.