Anisotropic conductive film

ACAs have more recently been used to perform the flex-to-board or flex-to-flex connections used in handheld electronic devices such as mobile phones, MP3 players, or in the assembly of CMOS camera modules.

During this time, ACA adapted to meet OLED's electrical and circuit design requirements, enabling its broader adoption in devices such as smartphones, TVs, and flexible displays.

[6] Currently there are many manufacturers of heat seal connectors and ACAs, but Hitachi and Sony continue to dominate the industry in terms of market share.

Other manufacturers of ACAs include 3M,[7] Loctite,[8] DELO,[9] Creative Materials,[10] Henkel, Sun Ray Scientific,[11] Kyocera,[12] Three Bond,[13] Panacol,[14] and Btech.

[15] In the very early years, ACAs were made from rubber, acrylic, and other adhesive compounds, but they rapidly converged on several different variations of thermoset biphenyl type epoxy resins.

ACF technology is used in chip-on-glass (COG), flex-on-glass (FOG), flex-on-board (FOB), flex-on-flex (FOF), chip-on-flex (COF), chip-on-board (COB), and similar applications for higher signal densities and smaller overall packages.

ACPs are typically used only in chip-on-flex (COF) applications with low densities and cost requirements, such as for RFID antennas, or in FOF and FOB assemblies in handheld electronics.