Bernoulli grip

A Bernoulli grip uses airflow to adhere to an object without physical contact.

While an accelerating, increasing speed, airstream has a low downstream static pressure, the sharp turn from linear to radial flow is the cause of a region of very low pressure around the blower exit hole.

This is the cause of a net force on the object in the direction normal to the side with higher local pressure.

Commercially available Bernoulli grips are commonly used to handle rigid sheet like material such as silicon wafers in circuit board manufacturing, or photovoltaic cell components.

The Bernoulli grip is also being investigated as a non-contact adhesion mechanism for wall climbing robots.