CAMM (memory module)

Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years.

The memory module is pressed and held in place against a bar with land grid array pin contacts which connect to the motherboard.

Systems with CAMM memory already installed cannot be expanded through adding additional CAMM modules in the same way that 2 DIMMs can be added alongside 2 existing DIMMs to expand total system memory.

The Compression Attached Memory Module specification was finalised and published by JEDEC as CAMM2 on December 5, 2023.

[10] The first computer, and laptop, to use CAMM2 memory modules is the Lenovo ThinkPad P1 Gen 7 released in April 2024.