Die preparation

During this step, the wafer is mounted on a plastic tape that is attached to a ring.

The picture on the right shows a 300 mm wafer after it was mounted and diced.

In the manufacturing of micro-electronic devices, die cutting, dicing or singulation is a process of reducing a wafer containing multiple identical integrated circuits to individual dies each containing one of those circuits.

During this process, a wafer with up to thousands of circuits is cut into rectangular pieces, each called a die.

A very thin and accurate saw is therefore needed to cut the wafer into pieces.