Digital image correlation analyses have applications in material property characterization, displacement measurement, and strain mapping.
[4][5] For example, if a stiff conformal coating or other polymeric encapsulation is allowed to flow under a QFN, its expansion and contraction during thermal cycling can add tensile stress to the solder joints and expedite fatigue failures.
When a PCBA is over-constrained, thermo-mechanical stress brought about during thermal expansion can cause board strains that could negatively affect individual component and overall assembly reliability.
The full-field monitoring capabilities of an image correlation technique allow for the measurement of strain magnitude and location on the surface of a specimen during a displacement-causing event,[10] such as PCBA during a thermal profile.
DIC techniques have also been used to generate strain maps from purely mechanical events, such as drop impact tests, on electronic assemblies.