Flip-Chip module

The first flip-chip modules mated with single-sided 18-contact card edge connectors with contacts on 1/8 inch centers.

The circuit boards (modules) were assembled into larger systems by plugging them into backplanes composed of blocks of connectors.

Manufacturing difficulties with this led DEC to investigate Gardner-Denver's automated wirewrap technology.)

[6] At some points during production, conventional discrete components may have replaced these flip-chip devices, but the early use of hybrid integrated circuits allowed DEC to market the PDP-8 as an integrated circuit computer.

DEC continued to hold the "Flip-Chip" trademark until June 6, 1987, when it was allowed to expire.