Gamal Refai-Ahmed is an Egyptian-Canadian-American engineer and technical executive known for his substantial contributions to thermal management, silicon architecture, and advanced packaging technologies.
Refai Ahmed's career spans over three decades, during which he has held senior technical positions at several leading technology companies, including AMD, GE, Cisco, and Nortel.
He has played a pivotal role in developing advanced silicon power thermo-mechanical architectures, enhancing thermal management and packaging technologies for Xilinx products across telecom, data centers, and automotive sectors.
[2] Refai Ahmed has received numerous awards and honors throughout his distinguished career: 2004: Elected as a Fellow of ASME, acknowledging his contributions to mechanical engineering and thermal management.
[11] Dr. Refai Ahmed has published extensively on topics related to thermal management, packaging technology, and high-performance computing.
He has served on the IEEE Fellow Committee, the Executive Member of the High-Density Packaging (HIR) Technical Working Group, and the Advisory Board of the NSF E2S Center.