HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.

[6] In 2020, the United States instituted rules that require any American firms providing equipment to HiSilicon or non-American firms who use American technologies or IPR (such as TSMC) that supply HiSilicon to have licenses[7] as part of the ongoing trade dispute, and Huawei announced it will stop producing its Kirin chipsets from 15 September 2020 onwards[8] due to this disruption of its supply chain.

On 29 August 2023, Huawei announced the first fully domestically fabricated chip, the Kirin 9000S, which is used on its latest Mate 60 Pro phablet series of phones and MatePad 13.2 tablets.

Though not exclusive, these SoCs see preliminary use in handheld and tablet devices of its parent company Huawei.

This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.

[19] (32GFlops) (41.8GFlops) • The Kirin 920 SoC also contains an image processor that supports up to 32-megapixel (76.8GFlops) • supports – SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode (76.8GFlops) (87GFlops) • supports – SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP

The system cache is 8 MB and the SoC works with the new LPDDR5/4X memories (made by Samsung in the Huawei Mate 40 series).

Due to the integrated 3rd generation 5G proprietary modem "Balong 5000", Kirin 9000 supports 2G, 3G, 4G and 5G SA & NSA Sub-6 GHz connectivity.

The 2021 4G version of the Kirin 9000 has the Balong modem limited via software to comply with the ban imposed on Huawei by the US government for non-chinese 5G technologies.

HiSilicon develops smartphone modems which are primarily used in its parent company Huawei's handheld and tablet devices.

[44] It is a multi-mode chipset supporting 3GPP Release 9 and LTE Category 4 at GTI (Global TD-LTE Initiative).

[53] It features: HiSilicon develops server processor SoCs based on the ARM architecture.

[55][56][57][58] It features: The Kunpeng 920 (formerly known as Hi1620) is HiSilicon's fourth generation server processor announced in 2018, and launched in 2019.

[60][61][62] It features: The Kunpeng 930 (formerly known as Hi1630) is HiSilicon's fifth-generation server processor announced in 2019 and scheduled for launch in 2021.

It features: The Kunpeng 950 is HiSilicon's sixth-generation server processor announced in 2019 and scheduled for launch in 2023.