IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society.

It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration.

It was established in 1999 and ceased publication in 2010.

The last editor-in-chief was Ganesh Subbarayan (Purdue University).

According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.