Multi-leaded power package

A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink.

The top of the package has a metal tab with a hole used in mounting the component to a heatsink.

The material used to electrically isolate the multi-leaded power package, like mica, needs to have a high thermal conductivity.

In applications where vertical clearance is at a premium (such as ISA cards in computers), it is often feasible to bend the leads at a right angle and mount the component flat to the printed wiring board using a screw and nut.

This often provides enough surface area to heatsink the component when power dissipation is moderately high.