Some company milestones: OmniVision's front-side illumination (FSI) technology is used to manufacture compact cameras in mobile handsets, notebook computers and other applications that require low-light performance without the need for flash.

Backside illuminated image (BSI) technology differs from FSI architectures in how light is delivered to the photosensitive area of the sensor.

The second-generation BSI technology, developed in cooperation with Taiwan Semiconductor Manufacturing Company Limited (TSMC), is built using custom 65 nm design rules and 300mm copper processes.

These technology changes were made to improve low-light sensitivity, dark current, and full-well capacity and provide a sharper image.

These fully integrated chip products have camera functionality and are intended to produce thin, compact devices.

The technical goal was to provide smaller camera modules that enable larger optical formats and offer improved image quality, especially in low-light conditions.

[18] Developed to address the low-light and night-vision performance requirements of advanced machine vision, surveillance, and automotive camera applications, OmniVision's Nyxel NIR imaging technology combines thick-silicon pixel architectures and careful management of the wafer surface texture to improve quantum efficiency (QE).

In addition, extended deep trench isolation helps retain modulation transfer function without affecting the sensor's dark current, further improving night vision capabilities.

[19] Performance improvements include image quality, extended image-detection range and a reduced light-source requirement, leading to overall lower system power consumption.

Deep trench isolation was extended to address issues with crosstalk without impacting modulation transfer function.

[26] OmniVision manufacturers liquid crystal on silicon (LCOS) projection technology for display applications.