[3] Joshi was elected Vice-President of Industry for the IEEE Circuits and Systems Society (CASS) in 2025.
[6] Integrated Circuit Interconnect Dr. Joshi led innovation in new materials for integrated circuit interconnects, including refractory metals contacts, liners, and deposition techniques, chemical mechanical polishing processes, and large grain copper to prevent adverse effects.
These inventions enabled replacement of conventional aluminum by copper and allowed achievement of multi-level wiring for further miniaturization of chips with low power.
Technology-Circuit Co-design Joshi demonstrated the first high performance register file which helped to make the decision to change from bulk to SOI technology.
Joshi demonstrated first time application of FinFET for low power and high performance SRAM and proposed strained non-planar devices.