This process is usually carried out by a multi-wire saw which cuts multiple wafers from the same crystal at the same time.
These wafers are then polished to the desired degree of flatness and thickness.
These saws had diamond particles embedded into their blades to cut silicon.
Multi-wire saws were introduced during the early 2000s.
The motivation behind this evolution was to reduce material losses from the saw's kerf, and to improve wafer's surface quality, flatness, and bow.