COM-HPC

Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio (MIPI SoundWire, I2S and DMIC), graphics, (PCI Express) up to Gen. 5, and Ethernet up to 25 Gbit/s per lane.

The COM modules plug into a carrier or base board that is typically customized to the application.

Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions.

COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and General Computing embedded applications and even scales up to RAM and performance hungry server or edge server applications.

[1] PICMG provides a preview version for free download.

COM-HPC Client Size A module with heat-spreader and customized carrier board
COM-HPC Module Size Overview
Overview of the possible IOs for COM-HPC Server and Client modules
Top Side of a COM-HPC Module with CPU and SODIMM memory socket
Bottom Side of a COM-HPC Module
COM-HPC Carrier Board Connector