COM Express

Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics (PEG), and Ethernet.

All I/O signals are mapped to two high density, low profile connectors on the bottom side of the module.

COM Express is commonly used in Industrial, military, aerospace, gaming, medical, transportation, Internet of things, and general computing embedded applications.

The COM Express standard was first released in 2005 by the PCI Industrial Computer Manufacturers Group (PICMG).

The Type 7 provides up to four 10 GbE interfaces and up to 32 PCIe lanes, making COM Express 3.0 appropriate for data center, server, and high-bandwidth video applications.

[4] (*2) DDI can be adapted to DisplayPort, HDMI, DVI or SDVO (legacy, no longer supported for types 6, 7 and 10) in the carrier board.

COM Express Type 6 Module VIA COMe-8X92 with VIA Nano X2
COM Express Carrier Board
COM Express has 4 form factors. See the PICMG COM Express specification for carrier board mounting positions.