[8] Caesium hydroxide fusion at 750°C produces complete dissolution of glass pellets.

[8] Due to its high reactivity, caesium hydroxide is extremely hygroscopic.

This technique can form pyramids and regularly shaped etch pits for uses such as Microelectromechanical systems.

It is known to have a higher selectivity to etch highly p-doped silicon than the more commonly used potassium hydroxide.

This compound is not commonly used in experiments due to the high extraction cost of caesium and its reactive behaviour.