A chiplet[1][2][3][4] is a tiny integrated circuit (IC) that contains a well-defined subset of functionality.
It is designed to be combined with other chiplets on an interposer in a single package to create a complex component such as a computer processor.
This provides several advantages over a traditional system on chip (SoC) which is monolithic as it comprises a single silicon die: Multiple chiplets working together in a single integrated circuit may be called a multi-chip module, hybrid IC, 2.5D IC, or an advanced package.
Chiplets may be connected with standards such as UCIe, bunch of wires (BoW), AIB, OpenHBI, and OIF XSR.
[10] The term was coined by University of California, Berkeley professor John Wawrzynek as a component of the RAMP Project (research accelerator for multiple processors) in 2006 [11][12] extension for the Department of Energy.