[3] Advanced packaging can help achieve performance gains through the integration of several devices in one package and associated efficiency gains (by reducing the distances signals have to travel, in other words reducing signal paths), and allowing for high numbers of connections between devices, without having to resort to smaller transistors which have become increasingly more difficult to manufacture.
[5] Advanced Packaging is considered fundamental in expanding the Moore’s Law.
[6][2] An example of heterogeneus integration is Intel's EMIB, which uses "bridges" made on silicon substrates, to connect different dies together.
[13] System integration consists of "ways to avoid putting everything on a single chip by creating a system that interconnects multiple smaller chips, or chiplets"[14] Advanced packages can have chiplets from several vendors.
[15][16] To enable this, standards for connecting chiplets have been developed such as UCie.