It is chiefly used in microelectronics as substrate for power semiconductor devices and high density multi-chip modules, where it aids with removal of waste heat.
Their high elastic modulus is favorable for absorbing vibrations and lowering material fatigue of attached modules and wire bonds.
Several variants exist: E-materials are prepared by impact grinding and then hot isostatic pressing into a block.
The block is then sliced to cards, sawn to required shape, polished, machined, and optionally plated with e.g. nickel, cadmium, chrome, silver, copper, or gold.
E-materials are used in aerospace technology, e.g. as laminated multi-chip modules in Iridium and Globalstar satellites, as heat sinks, and in avionics of F-22 Raptor, F-16 Fighting Falcon, F/A-18 Hornet, and the Joint Strike Fighter.