Electrochemical migration (ECM) is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode.
The process is most commonly observed in printed circuit boards where it may significantly decrease the insulation between conductors.
If there is a sufficient film of moisture with condensation and even at low electrical voltage, the ECM can form a bridging structure between the contacts after just a few minutes.
[2] In general, the process can be broken down into the following steps:[3] This mechanism impairs the reliability and longevity of electronic assemblies.
This means that electrochemical migration is often the focus of failure root cause analyses as a possible trigger for malfunctions in the field.