This charge, voltage, or resistance is then measured, digitized, and used to construct an image of the object, scene, or phenomenon that emitted the photons.
This set of functions is implemented on a chip called the multiplexer, or readout integrated circuits (ROIC), and is typically fabricated in silicon using standard CMOS processes.
The detector array is then hybridized or bonded to the ROIC, typically using indium bump-bonding, and the resulting assembly is called an FPA.
The data correction can be done in software, in a DSP or FPGA in the camera electronics, or even on the ROIC in the most modern of devices.
The low volumes, rarer materials, and complex processes involved in fabricating and using IR FPAs makes them far more expensive than visible imagers of comparable size and resolution.
This cross talk was attributed to capacitive coupling between the microstrip lines and between the FPA’s internal conductors.
By replacing the receiver in the breadboard for one with a shorter focal length, the focus of the collimator was reduced and the system’s threshold for signal recognition was increased.
[2] Another method was to add a flat thinned substrate membrane (approximately 800 angstroms thick) to the FPA.
[5] In another an avalanche photodiode FPA study, the etching of trenches in between neighboring pixels reduced cross talk.