Organic solderability preservative or OSP is a method for coating of printed circuit boards.
Compared to the traditional HASL process, the OSP process is widely used in the electronics manufacturing industry because it does not require high-temperature treatment and significantly reduces the risk of metal corrosion, environmental impact and damage to electronic components.
The OSP process involves delicate steps designed to ensure the uniformity and quality of the protective layer.
Although environmentally friendly and suitable for microelectronic manufacturing, the complexity of the process requires strict control of the composition and quality of the coating agent to guarantee consistent board performance.
The compounds typically used are from the azole family such as benzotriazoles, imidazoles, benzimidazoles.