Package on a package

This PoP technology enables smaller packages with shorter electrical connections and is supported by companies such as Advanced Semiconductor Engineering (ASE).

Electrically, PoP offers benefits by minimizing track length between different interoperating parts, such as a controller and memory.

[4][5] The earliest known commercial use of a 3D package-on-package chip was in Sony's PlayStation Portable (PSP) handheld game console, released in 2004.

The PSP hardware includes eDRAM (embedded DRAM) memory manufactured by Toshiba in a 3D package chip with two dies stacked vertically.

[8] The same month, U.S. patent 7,923,830 ("Package-on-package secure module having anti-tamper mesh in the substrate of the upper package") was filed by Steven M. Pope and Ruben C. Zeta of Maxim Integrated.

Typical logic plus memory PoP stack, common to mobile phone SoCs or baseband modems from 2005 onward