Perfboard

Discrete components are soldered to the prototype board such as resistors, capacitors, and integrated circuits.

The 0.1 inches (2.54 mm) grid system accommodates integrated circuits in DIP packages and many other types of through-hole components.

Before building a circuit on perfboard, the locations of the components and connections are typically planned in detail on paper or with software tools.

In this case, the designer positions the components so all leads fall on intersections of a 0.1 inches (2.54 mm) grid.

Once the layout is finalized, the components are soldered in their designated locations, paying attention to orientation of polarized parts such as electrolytic capacitors, diodes, and integrated circuits.

into position, trimming off extra length, and soldering the lead to make the required electrical connection.