[2] Officially launched as part of Steve Jobs' keynote presentation at the Worldwide Developers Conference in June 2003, the Power Mac G5 was introduced with three models, sharing the same physical case, but differing in features and performance.

The computer was soon dismantled and replaced with a new cluster made of an equal number of Xserve G5 rack-mounted servers, which also used the G5 chip running at 2.3 GHz.

This completely automated facility in East Fishkill, New York figured heavily in IBM's larger microelectronics strategy.

CMOS 9S is the combination of SOI, low-k dielectric insulation, and copper interconnect technology, which were invented at IBM research in the mid-1990s.

The Power Mac G5 line in 2006 consisted of three, dual-core PowerPC G5 configurations, which can communicate through its HyperTransport at half its internal clock speed.

The processor at the heart of the Power Mac G5 has a "superscalar, superpipelined" execution core that can handle up to 216 in-flight instructions, and uses a 128-bit, 162-instruction SIMD unit (AltiVec).

This noise problem was not fixed until the dual core generation of G5s was produced, however it did not affect the "Late 2004" model (at least there have never been any reports).

[16] Although the noise problems did not prevent the affected computers from working, they were problematic for audio professionals and enthusiasts, especially for the liquid-cooled models, which had been expressly designed as mechanically quiet for discerning listeners.

A common problem among single processor G5s was the cyclic expansion and contraction of a metal plate soldered to the Logic Board connecting all eight of the RAM slots.

Semi announced the preliminary pre-production plan of PWRficient processor,[18] there had been persistent rumors that Apple would prepare for its use in its professional line of personal computers.

Semi promptly delivering processor chips for Apple's personal computer notebook line and possibly desktops.

The version that would be sampled for pre-production at third quarter of 2006 was a 2 GHz, dual-core CPU with two DDR2 memory controllers, 2 MB of L2 cache, and support for 8 PCI Express lanes.

The sampled chip also has lower heat intensity than Intel's Core Duo, which gives off 9–31 W under normal load.

Semi's engineering resources to develop ARM CPUs for their iPhone, iPod Touch, iPad, and Apple TV product lines; and would go on to eventually come full circle with these designs replacing Intel chips in Macs in 2020.