Power module

Besides modules that contain a single power electronic switch (as MOSFET, IGBT, BJT, Thyristor, GTO or JFET) or diode, classical power modules contain multiple semiconductor dies that are connected to form an electrical circuit of a certain structure, called topology.

[4] Press-fit pins achieve a very high reliability and ease the mounting process without the need for soldering.

Both can have negative effects on the electromagnetic radiation (EMR) of the module if it is operated as an inverter, for instance.

A further aspect for optimization is the so-called thermal path between the heat source (the dies) and the heat-sink.

The heat has to pass through different physical layers such as solder, DCB, baseplate, thermal interface material (TIM) and the bulk of the heat-sink, until it is transferred to a gaseous medium such as air or a fluid medium such as water or oil.

High power IGBTs (here a 3300V, 1200A switch) are obtained by connecting tens of dies in parallel in a power module.
Opened IGBT module; different semiconductor dies are connected via wire bonds while external connectors are connected to lead-frame structures