Selective soldering

[1] The miniature wave selective solder fountain type is widely used, yielding good results if the PCB design and manufacturing process are optimized.

Key requirements for selective fountain type soldering are: The Drop-Jet[2] is an Electromechanical device which is capable of depositing a droplet of flux on demand onto a surface such as a Printed Circuit Board and or component pin.

As number of miniature profiling dataloggers are now available to make the process more simple such as the Solderstar Pro units.

[3][4] A number of fixtures are available to allow daily checking of the selective solder process, these instruments allow the verification of machine parameters to be performed on a periodic basis.

Parameters such as contact time, X/Y speeds, nozzle wave height and profile temperature can all be measured.