Reflow oven

In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel.

The nitrogen reflow oven takes a few minutes to reduce Oxygen concentration to acceptable levels within the chamber.

The liquid used is chosen with a desired boiling point in mind to suit the solder alloy to be reflowed.

Pressure curing ovens, or Autoclave, is widely utilized to minimize voiding and improve adhesion strength in bonding processes.

Pressure cure ovens are typically employed in die attach and underfill applications.

During the vacuum process, the circuit board is stationary, assuring no shifting parts.

Upon injection, the formic acid removes any oxides present on the metal prior to reflow.

During production, only one door opens at a time, thus isolating the process chamber and lowering nitrogen and formic acid consumption.