It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry,[1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability.
These initiatives resulted in tin-silver-copper alloys being considered and tested as lead-free solder ball alternatives for array product assemblies.
However, its performance was criticized because it left a dull, irregular finish and it was difficult to keep the copper content under control.
One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method.
However, a number of companies have started offering 260 °C compatible components to meet the requirements of Pb-free solders.
Also, the failure mode is changed from a partially brittle joint separation to a ductile tearing with the SAC.