Quilt packaging

[1][2] QP nodules are created as an integral part of a microchip using standard back end of the line techniques in semiconductor device fabrication.

[3] Small high yielding “chiplets” made from any semiconductor material (silicon, gallium arsenide, silicon carbide, gallium nitride, etc.

[5] Multiple measured insertion loss on QP interconnects have been conducted on quilted chipsets with sets of homogeneous and heterogeneous semiconductor materials.

Radio frequency S-parameter measurements were made from DC to 220 GHz.

Loss rapidly improves as the gap approaches zero, which is achievable with Quilt Packaging assembly tolerances.