Compliant bonding

The use of a compliant medium also overcomes the thickness variations when attempting to bond a multiple number of conductor wires simultaneously to a gold metalized substrate (Figure 4).

An important application for compliant bonding arose in the early 1960s, when techniques were developed[4] for fabricating a beam leaded silicon integrated circuit “chip” consisting of pre-attached electroformed 0.005-inch thick gold leads or “beams” extending from the silicon chip (Figure 5).

The extended ends of the electroformed beams could then be permanently solid-state bonded to a matching metallized sunburst circuit which has been pre-deposited on a ceramic substrate appropriately packaged in a computer in the making.

[5] Figures 9. and 10 show that the compliant tape offers the advantage of carrying the beam leaded chip to the bonding site as discussed above.

Figure 11 shows a beam leaded silicon integrated circuit compliantly bonded to a gold metallized sunburst pattern deposited on an alumina ceramic substrate which will be encapsulated and packaged in a computer-type device.

Figure 1. Compliant bonding a gold wire (Click to enlarge view)
Figure 2. Solid-state/ wire bonding bonding a gold wire with a hard faced bonding tool.
Figure 3. Stages of compliant bonding gold wires to a gold metallized surface.
Figure 4. Compliant bonding wires of varying sizes simultaneously.