The bonding process produces joints with a uniform composition profile, tolerant of surface oxides and geometrical defects.
The bonding technique has been exploited in a wide range of applications, from the production and repair of turbine engines in the aerospace industry,[1][2][3] to nuclear power plants,[4][5] and in making connections to integrated circuit dies as a part of the microelectronics industry.
Solid state diffusional processes lead to a change of composition at the bond interface and the dissimilar interlayer melts at a lower temperature than the parent materials.
Thus, a thin layer of liquid spreads along the interface to form a joint at a lower temperature than the melting point of either of the parent materials.
If sufficient interdiffusion occurs, the joint will remain solid and strong well above the original melt process temperature.