It is a destructive technique requiring that a portion of the sample be cut or ground away to expose the internal plane for analysis.
[1][2] Printed wiring boards (PWBs) and electronic components and their solder joints are common cross sectioned samples.
Cross sections can be prepared by several methods typically chosen based on the scale of the feature of interest because the technique affects the smoothness of the final polish.
Viewing the internal structures of electronic components by cross section can reveal problems with manufacturing and material quality.
Cross sections of component solder joints are commonly prepared to assess the quality and extent of the metallurgical bond.
Crack morphology can lead to identification of the type of stress and ultimately the root cause of the solder joint failure.