The name is also applied more broadly to the Xeon and Core i7 Extreme Ivy Bridge-E series of processors released in 2013.

[30] Impress PC Watch, a Japanese website, performed experiments that confirmed earlier speculations that this is because Intel used a poor quality (and perhaps lower cost) thermal interface material (thermal paste, or "TIM") between the chip and the heat spreader, instead of the fluxless solder of previous generations.

[34] Enthusiast reports describe the TIM used by Intel as low-quality,[33] and not up to par for a "premium" CPU, with some speculation that this is by design to encourage sales of prior processors.

[31] Further analyses caution that the processor can be damaged or void its warranty if home users attempt to remedy the matter.

[30] Experiments with replacing this TIM with a higher-quality one or other heat removal methods showed a substantial temperature drop, and improvements to the increased voltages and overclocking sustainable by Ivy Bridge chips.

[46][48] For the intermediate LGA 1356 socket, Intel launched the Xeon E5-2400 v2 (codenamed Ivy Bridge-EN) series in January 2014.

[50] A new Ivy Bridge-EX line marketed as Xeon E7 v2 had no corresponding predecessor using the Sandy Bridge microarchitecture but instead followed the older Westmere-EX processors.