The pair developed Smart Cut™ technology to industrialize Silicon-On-Insulator (SOI) wafers, and built their first production unit in Bernin, in the Isère department of France.

The company also has R&D centers and commercial offices in France, the United States (Arizona and California), China, South Korea, Japan and Taiwan.

Historically, Soitec has marketed Silicon on Insulator (SOI) as a high performance material for manufacturing electronic chips for computers, game consoles and servers, as well as the automotive industry.

With the rapid growth of the Internet of Things, wearables, and other mobile devices, new needs have arisen in terms of performance and energy efficiency of electronic components.

For this market, Soitec offers materials that help reduce the energy consumed by chips, improve their information processing speed, and support the needs of high-speed Internet.

[7] It makes possible the transfer of a thin layer of monocristalline material from a donor substrate to another by combining ion implantation and bonding by molecular adhesion.

Smart Stacking™ technology is used for back-side illuminated image sensors, where it improves sensitivity and enables a smaller pixel size, as well as in smartphone radio-frequency circuits.