PlayStation 4 technical specifications

[8][9][10] Other minor changes to the design included mechanical buttons replacing electrostatic touch sensitive ones, and a shorter but brighter LED indicator on the top surface of the console.

[17] The upgraded PS4 Pro (originally codenamed 'Neo',[18][19] product code CUH-7000) used a more powerful APU built with a 16 nm FinFET process from TSMC.

The number of graphics Compute Units on the APU doubled to 36 Graphics Core Next (GCN) Compute Units (from 18), with a clock speed increase to 911 MHz (from 800 MHz), resulting in a theoretical single precision floating point performance metric of 4.19 TeraFLOPs.

[20] A limited translucent-case version of the PS4 Pro was released in August 2018, which includes minor hardware updates.

[23] A second minor hardware refresh, with model number CUH-7200, was first released in bundles with Red Dead Redemption 2 in November 2018.

When it is done carefully and correctly,[25] The procedure has low to medium risk and takes between fifteen minutes and two hours depending on one's skill and familiarity with the console.

[28][29] The console also includes secondary custom chips that handle tasks associated with downloading, uploading, and social gameplay.

[34] The 2013 release version APUs contained 20 GCN compute units on die,[35] two of which are thought to be present to provide redundancy to improve manufacturing yield.

GPU specifications:[45] The graphics processing unit (GPU) is AMD's GPGPU-capable Radeon GCN architecture, consisting of 18 compute units (CUs) for a total of 1,152 cores (64 cores per CU), that produces a theoretical peak performance of 1.84 TFLOPS.

[46] This processing power can be used for graphics, physics simulation, or a combination of the two, or any other tasks suited for general purpose computing.

Though based on AMD's GCN architecture, there are several known differentiating factors between the PS4's GPU and current-gen PC graphics cards featuring first-gen GCN architecture: Sharing the die with the rest of the components of the APU is a Digital signal processing SIP block that is either identical to AMD TrueAudio or shares a certain amount of similarity with it.

This means the system memory is not partitioned, so that a portion of it is exclusively available to the GPU, but unified, hence enabling hardware zero-copy.

[46][52] This is 16 times the amount of total RAM found in the PS3 and was expected to give the console considerable longevity.

[54] The PS4 includes a secondary ARM processor (with separate 256 MiB of RAM) to assist with background functions and OS features.

[54][57] To further enhance optical drive performance, the PS4 features a hardware on-the-fly zlib decompression module (a special piece of hardware used to quickly decompress the data on the Blu-ray disc, which has been compressed to save space and bandwidth), allowing for greater effective bandwidth, whilst at the same time, the console continuously caches data onto its hard disk, even buffering unread data when a game is not actively accessing the optical drive, forming part of Sony's PlayGo strategy.

[63] System Software 4.50, which was introduced on March 9, 2017,[64] enabled the use of external USB hard drives up to 8 TB for additional storage.

[75] The originally released version had a maximum power rating of 250 W.[76] According to tests by Eurogamer, initial consoles drew approximately 80 W when operational in menu mode, rising to around 110–120 W in gameplay, with peaks of 140 W with both gameplay and menus active,[77] tests by the Natural Resources Defense Council showed similar power consumption figures with 137 W gameplay peaks (with PS4 Camera connected); power consumption in (internet-connected) standby mode was measured at 8.8 W under the same conditions, with a lower power "off" state drawing 0.5 W.[78] The PS4 cooling system uses a single centrifugal fan, which draws air in from both sides of the console, split into flows above and below the main PCB, before entering the fan from top and bottom; the fan exhaust then cools the main APU via a heat pipe-connected heatsink, with the exhaust passing over the main power supply before being emitted from the rear of the console.