Die (integrated circuit)

Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography.

[1][2] To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms.

Functional dies are then packaged and the completed integrated circuit is ready to be shipped.

One common use case of an integrated circuit die is in the form of a central processing unit (CPU).

Through advances in modern technology, the size of the transistor within the die has shrunk exponentially, following Moore's law.

Die of LM2576T monolithic integrated circuits step−down switching regulator (buck converter) which contains 162 active transistors (based on datasheet). The Biggest part of die on the left side is Built-in 3 Ampere power transistor and the damaged and fried part of die is clearly visible as a small black in power transistor section.
LM2576T monolithic integrated circuit die
1-watt red power LED die
Typical NPN transistor. Size of die is roughly 1 mm × 1 mm .