Modern electronic assembly methods employ a myriad of bonding processes, each one a vital step in the manufacture of the final product.
A typical consumer product such as a laptop computer may contain hundreds of thousands of bonds yet if one fails it will probably result in a system breakdown.
Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysis as desired.
Powerful extended capabilities enable measurements such as force/time or force/distance curves to be made and deliver more data about the quality of the bond tested.
Modern bond testers can perform a wide variety of tests with high precision, because automation eliminates human influence on the measurement.