Heat spreader

The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond.

The fluids circulate either passively, by spontaneous convection, triggered when a threshold temperature difference occurs; or actively, because of an impeller driven by an external source of work.

The high conduction properties of the spreader will make it more effective to function as an air heat exchanger, as opposed to the original (presumably smaller) source.

Such materials are often used as substrates for chips, as their thermal expansion coefficient can be matched to ceramics and semiconductors.

Their proposed method is based on the use of heat spreaders consisting of an electrical insulating layer of poly (2-chloro-p-xylylene) (Parylene C) and a coating of copper.

This 120 mm-diameter vapor chamber (heat spreader) heat sink design thermal animation was created using high resolution computational fluid dynamics (CFD) analysis, and shows temperature-contoured heat sink surface and fluid flow trajectories, predicted using a CFD analysis package.