Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron.
Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier.
Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components.
Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame.
Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.
A variety of techniques for interconnecting several chips within a single package have been proposed and researched: Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans.
[38][39] [40][41][42] Mostly resistors and diodes; barrel shaped components, dimensions do not match those of rectangular references for identical codes.