List of electronic component packaging types

Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron.

Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier.

Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components.

Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame.

Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.

A variety of techniques for interconnecting several chips within a single package have been proposed and researched: Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans.

[38][39] [40][41][42] Mostly resistors and diodes; barrel shaped components, dimensions do not match those of rectangular references for identical codes.

A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC .
Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
Example WL-CSP devices sitting on the face of a U.S. penny . A SOT-23 device is shown (top) for comparison.
A drawing of a ZN414 IC in a TO-18 package
A general surface mount chip, with major dimensions.
A general surface mount chip, with major dimensions.
A general through-hole pin chip, with major dimensions.
A general through-hole pin chip, with major dimensions.
TSSOP Package
TSSOP Package
Example of component sizes, metric and imperial codes and comparison included
Composite image of a 11×44 LED matrix lapel name tag display using 1608/0603-type SMD LEDs. Top: A little over half of the 21×86 mm display. Center: Close-up of LEDs in ambient light. Bottom: LEDs in their own red light.
SMD capacitors (on the left) with two through-hole capacitors (on the right)
Various SMD chips, desoldered
MLP package 28-pin chip, upside down to show contacts