Thin shrink small outline package

The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.

They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operational amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics.

[1] The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package.

This is a rectangular metal pad on the bottom side of the package.

[2] The Heat sink thin shrink small outline package[3] (HTSSOP) is Texas Instruments name for a TSSOP with an exposed pad on the bottom side.