Small outline integrated circuit

Small outline actually refers to IC packaging standards from at least two different organizations: Note that because of this, SOIC is not specific enough of a term to describe parts which are interchangeable.

Many electronic retailers will list parts in either package as SOIC whether they are referring to the JEDEC or JEITA/EIAJ standards.

Next to the narrow SOIC package (commonly represented as SOx_N or SOICx_N, where x is the number of pins), there's also the wide (or sometimes called extended) version.

Applications for a SSOP enable end-products (pagers, portable audio/video, disc drives, radio, RF devices/components, telecom) to be reduced in size and mass.

The ICs on DRAM memory modules were usually TSOPs until they were replaced by ball grid array (BGA).

TSSOPs are particularly suited for gate drivers, controllers, wireless / RF, op-amps, logic, analog, ASICs, memory (EPROM, E2PROM), comparators and optoelectronics.

The exposed pad (EP) variant of small outline packages can increase heat dissipation by as much as 1.5 times over a standard TSSOP,[citation needed] thereby expanding the margin of operating parameters.

Additionally, the exposed pad can be connected to ground, thereby reducing loop inductance for high-frequency applications.