Thin small outline package

They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.

In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities.

SRAM, flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products.

TSOP is the smallest leaded form factor for flash memory.

The table below shows basic measurements for common TSOP packages.