Quad in-line package

The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket.

The QIP has the same dimensions as a Dual in-line package (DIP), but the leads on each side are bent into an alternating zigzag configuration so as to fit four lines of solder pads (instead of two with a DIP but similar to Zig-zag in-line package).

[2] Intel and 3M developed the ceramic leadless quad in-line package (QUIP), introduced in 1979, to boost microprocessor density and economy.

The chip itself lacks the normal pins, and instead ends in small metal pads on a flat carrier, these make contact with spring-loaded wires in the socket.

It was used by Intel for the iAPX 432 microprocessor chip set, and by Zilog for the Z8-02 external-ROM prototyping version of the Z8 microcontroller.