Mini Small Outline Package

The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits.

Many integrated circuits are available in the MSOP form factor.

They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in disk drives, video/audio and consumer electronics.

[2][3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability.

[1] Some versions have an exposed pad on the bottom side.