Chip carrier

Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC.

Types of chip-carrier package are usually referred to by initialisms and include: A plastic-leaded chip carrier (PLCC) has a rectangular plastic housing.

Texas Instruments later released a postmolded variant that was soon adopted by most major semiconductor companies.

The metal strip forming the lead is wrapped around and under the edge of the package, resembling the letter J in cross-section.

The motivation for a surface-mount PLCC socket would be when working with devices that cannot withstand the heat involved during the reflow process, or to allow for component replacement without reworking.

PLCCs continue to be used for a wide variety of device types, which would include memory, processors, controllers, ASICs, DSPs, etc.

A leadless chip carrier (LCC) has no "leads", but instead has rounded pins through the edges of the ceramic or molded plastic package.

Intel 80186 in QFJ68 / PLCC68, an example of a plastic leaded chip carrier
Reverse side of an Intel 80C86 : J-shaped metal leads
Gigabyte DualBIOS in QFJ32 / PLCC32
Leaded chip carrier extraction tool. Vacuum picks may also be used instead.
Ceramic leadless package of Intel 80286 (bottom) [ 6 ]