Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC.
Types of chip-carrier package are usually referred to by initialisms and include: A plastic-leaded chip carrier (PLCC) has a rectangular plastic housing.
Texas Instruments later released a postmolded variant that was soon adopted by most major semiconductor companies.
The metal strip forming the lead is wrapped around and under the edge of the package, resembling the letter J in cross-section.
The motivation for a surface-mount PLCC socket would be when working with devices that cannot withstand the heat involved during the reflow process, or to allow for component replacement without reworking.
PLCCs continue to be used for a wide variety of device types, which would include memory, processors, controllers, ASICs, DSPs, etc.
A leadless chip carrier (LCC) has no "leads", but instead has rounded pins through the edges of the ceramic or molded plastic package.