Alongside powering the RX 7000 series, RDNA 3 is also featured in the SoCs designed by AMD for the Asus ROG Ally, Lenovo Legion Go, and the PlayStation 5 Pro consoles.

[1] AMD announced to investors their intention to achieve a performance-per-watt uplift of over 50% with RDNA 3 and that the upcoming architecture would be built using chiplet packaging on a 5 nm process.

[4] For the first time ever in a consumer GPU, RDNA 3 utilizes modular chiplets rather than a single large monolithic die.

[5] The decision to move to a chiplet-based GPU microarchitecture was led by AMD Senior Vice President Sam Naffziger who had also lead the chiplet initiative with Ryzen and Epyc.

[6] The development of RDNA 3's chiplet architecture began towards the end of 2017 with Naffziger leading the AMD graphics team in the effort.

On Ryzen and Epyc processors, AMD used its PCIe-based Infinity Fabric protocol with the package's dies connected via traces on an organic substrate.

Naffziger explains that "The bandwidth density that we achieve is almost 10x" with the Infinity Fanout rather than the wires used by Ryzen and Epyc processors.

RDNA 3's Compute Units (CUs) for graphics processing are organized in dual CU Work Group Processors (WGPs).

Rather than including a very large number of WGPs in RDNA 3 GPUs, AMD instead focused on improving per-WGP throughput.

[14] While RDNA 3 doesn't include dedicated execution units for AI acceleration like the Matrix Cores found in AMD's compute-focused CDNA architectures, the efficiency of running inference tasks on FP16 execution resources is improved with Wave MMA (matrix multiply–accumulate) instructions.

AMD touted its support for DisplayPort 2.1 UHBR 13.5, delivering up to 54Gbps bandwidth for high refresh rates at 4K and 8K resolutions.